When making a PCB circuit board, a detailed description of the PCB surface treatment process is attached. The choice of PCB surface treatment process has a direct impact on the product quotation. Of course, different process treatments have their advantages and disadvantages, and the most important thing is to see where the product is applied. Let's take a look at the disadvantages of common PCB surface treatment processes together:

PCB circuit board production

1. OSP organic anti-oxidation - highly susceptible to acid and humidity effects. After PCB storage for more than 3 months, it needs to undergo a new surface treatment process and be used up within 24 hours of opening the packaging. OSP is an insulating layer, and solder paste needs to be printed at the testing point to treat the original OSP layer before contacting the pin points for electrical testing.

2. Hot air leveling - pins with fine gaps and components that are too small are not suitable for soldering. Due to the poor surface flatness of PCB tin spraying boards, tin beads are prone to occur during PCB processing, which can also easily form solder joints for pin components with fine gaps.

PCB processing

3. Chemical silver deposition - not only is the cost high when making PCB boards, but the soldering performance is also not very good. By using the electroless nickel plating process, black disks can easily form, and the nickel layer will oxidize over time. Long term reliability is also a problem.

4. Electroplated nickel gold - PCB boards treated with electroplated nickel gold technology have a slightly inferior color and a darker gold color, and the color is not as bright as those treated with other processes.