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Shanghai Minyang Circuit Board Co., Ltd. is a senior supplier specializing in the design and processing of high-density multi-layer circuit boards and soft hard combination circuit boards, as well as providing flexible circuit board product solution design, technical improvement, and production and processing services. If you need items not listed, please contact Minyang so that we have the opportunity to meet your personal needs.

Shanghai Minyang Circuit Board Co., Ltd. provides advanced printed circuit board manufacturing services that meet all industry requirements. Its products are widely used in fields such as automotive, computer, medical equipment, communication tools, industrial control, military, and aviation industries.

PCB function
project capacity
Monthly/Ability 15000 square meters per month
storey Floors 1-32
plate material FR-4 Tg130 / FR-4 tg140 / FR-4 Tg150 / FR-4 Tg170 / FR-4 Tg180 / FR-4 Tg210 / FR-4 Tg230 / FR-4 CTI175 / FR-4 CTI300
Surface Treatment Chemical nickel gold/gold plating/tin deposition/lead-free tin/OSP
Welding surface color Green/Blue/Red/Black/Yellow/White/Matte Green/Matte Black
Screen printing color White, black, yellow
public errand Plate thickness tolerance/Plate thickness≤ 1.0mm:/-0.1mm/Plate thickness 1.0-2.0mm:/-10%/Plate thickness>2.0mm:/-8%
PTH diameter tolerance:/-0.075mm/NPTH diameter tolerance:/-0.05mm/hole position tolerance:/-0.075mm
Contour tolerance/length: 100mm:/-0.1mm/length 100-300mm:/-0.15mm/length>300mm:/-0.2mm
V-shaped cutting tolerance:/-0.1 mm
technical specifications Minimum line width/spacing: 0.075/0.075mm
Minimum PTH copper thickness: 20um
Minimum aperture: 0.15mm
Minimum gasket ring: 0.1mm
UL certified maximum copper thickness: 6oz (including multi-layer, double-layer, and single-layer boards)
Maximum board size: 560 * 410mm
Board thickness/double-sided board: 0.2-7.0mm/multi-layer board: 0.4-7.0mm
Welding mask bridge:>0.08mm
Aspect ratio: 8:1
Through hole sealing ability: 0.2-0.6mm
Bow and torsion: 0.75%
Au, Ni, Hasl thickness: 1, immersion gold: Au 1-4U” /2. Gold Finger: Au 1-50U” /3. Gold plating: Au 1-5U” /4. Ni thickness: 100-200U; /5. Hasl thickness: 1-50um/6, OSP thickness: 0.3-0.5um